Substrate package

ABSTRACT

A sealable contamination proof container package bottom and top for storing and transporting a plurality of substrates or wafers in a robotic wafer carrier. The package bottom includes four sides, a continuous vertical surface for tape sealing surrounding the four sides, a lip positioned on a vertical edge, opposing hook latches on opposing sides, opposing hand grip recesses on the opposing sides and a raised bottom surface for package stacking. The package top includes four sides, a continuous vertical surface for tape sealing surrounding the four sides, a lip positioned on the vertical surface, opposing hook catches on the opposing side, a top surface with raised stacking surfaces, and two rows of wafer support springs positioned on bars on the underside of the top surface. The package top and bottom halves provide that the robotic wafer carrier mates between the package top and package bottom with the wafers or substrates in the carrier. The package top and bottom mate with the upper lip engaged with the lower lip, and the catches of the top engage with the latches of the bottom. The package halves are designed in such a fashion as to prevent wafer or substrate damage upon opening, in that the top package half is moved in a direction coinciding to the plane of the wafers or substrates with respect to positioning of the catches and latches on the package side. Appropriate sides of the package top and bottom are plumb with each other providing for a flush perimeter for ease of taping. The raised top portion of the top package half and the recessed bottom of the bottom package half provides for stacking of like packages. In an alternative embodiment, opposing rows of articulated cantilevered horizontal arms with centering V grooves on each end for engaging a wafer, disk or substrate extend inwardly from the edges of an arced top surface in the package top.

CROSS REFERENCES TO CO-PENDING APPLICATIONS

This is a Continuation-in-part of U.S. Ser. No. 07/198,464, filed May24, 1988, now pending and assigned to the same assignee which is acontinuation-in-part of U.S. Ser. No. 707,435, filed July 7, 1987, nowissued as U.S. Pat. No. 4,793,488, on Dec. 27, 1988.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention pertains to a package, and more particularly,pertains to a two-part package for the storing and transporting ofsemiconductor wafers, disks or substrates in a robotic wafer carrier.The package includes articulated cantilevered horizontal arms withcentering V grooves for engaging the member.

2. Description of the Prior Art

Prior art packages have usually lifted from the end. This end liftingcaused stress and strain on the end wafers, and sometimes causedbreakage as the top slid against the plane of one or more wafers.Further, most prior art packages have opened from the ends, rather thanopening from the sides, which resulted in damage from the spring tensionon the last tooth and then on the last semiconductor wafer, disk orsubstrate.

Prior art devices also included wafer hold down members which slidagainst the periphery of the contained wafer substrate causing anabrasive scraping action which dislodged or caused small particles tobreak loose near the peripheral edge of the wafer substrate and allowingparticle contaminants to invade the otherwise clean interior of thesubstrate package.

The present invention overcomes the disadvantages of the prior art byproviding a package which opens on the side, and by providing wafersupport springs which do not scrape or grate upon the wafer substrate,but instead flexingly engage the wafer substrates. The wafer supportsprings are articulated cantilevered horizontal arms with centering Vgrooves.

SUMMARY OF THE INVENTION

The general purpose of the present invention is to provide a package forwafers or substrates which opens from the sides and evenly secures andprevents contamination of semiconductor wafers or like articles.

According to one embodiment of the present invention, there is provideda sealable contamination proof semiconductor wafer package, including abottom and a top. The bottom includes four sides, a continuous verticalsurface for tape sealing surrounding the four sides with a lippositioned on a vertical edge, opposing hook latches, opposing hand griprecesses on the opposing sides and a raised bottom surface for stackingof a plurality of packages. The top includes four sides, continuousvertical surface for tape sealing; and surrounding the four sides, a lippositioned on the vertical surface, opposing hook catches, a top surfacewith a raised stacking surface, and opposing rows of wafer supportsprings on a two bar articulated member positioned on the underside ofthe top surface.

According to another embodiment of the present invention, there isprovided a sealable contamination proof semiconductor wafer package,including a bottom and a top. The bottom includes four sides, acontinuous vertical surface for tape sealing surrounding the four sideswith a lip positioned on a vertical edge, opposing hook latches,opposing hand grip recesses on the opposing sides and a raised bottomsurface for stacking of a plurality of packages. The top includes foursides, continuous vertical surface for tape sealing; and surrounding thefour sides, a lip positioned on the vertical surface, opposing hookcatches, an arced top surface with raised stacking surfaces, andopposing rows of horizontally aligned wafer support springs positionedon the underside of the arced top surface. The wafer support springs arearticulated cantilevered horizontal arms with centering V grooves.

Significant aspects and features of the present invention include asemiconductor wafer, disk or substrate package which opens from thesides, which thereby equally provides spring pressure on the wafers. Thehandle is located under the lock assembly. The perimeter of the packageis tapable, and further seals the locks. The locks are of such aconfiguration as to allow a plurality of human fingers and roboticactuators to disengage the lock. Finally, the bottom and the top of thepackage engage with respect to other like packages for stackingpurposes. The package is also aesthetically pleasing by the formation ofthe surfaces of the package, and the radius geometry on top and bottomare to provide structural support.

Another significant aspect and feature of the present invention isopposing upper rows of horizontally aligned wafer support articulatedcantilevered horizontal arms with centering V grooves on the under sideof the arced top surface which flexingly engage wafers, disks orsubstrates. The wafer support springs are articulated cantileveredhorizontal arms with centering V grooves. The wafer, disk or substrateis captured in the V groove with minimal contact across the edges of thewafer, disk or substrate.

Other significant aspects and features include articulated cantileveredhorizontal arms with centering V grooves which provide minimized reap orstress and optimized tension about the wafer, disk or substrate. The Vgrooves center about the edges of the wafers, disks or substrates. Thehorizontal arm with the V groove provides enhanced memory formaintaining the wafer, disk or substrate in the carrier. The V groovesare integrally supported on the articulated cantilevered horizontalarms.

Further significant aspects and features include a package of seethrough polymer such as a polypropleyene or like polymer material toensure arm and V groove alignment with a wafer, disk or substrate.

Having thus described the embodiments of the present invention, it is aprincipal object hereof to provide a package for transporting andstoring of semiconductor wafers, disks or substrates.

Objects of the present invention include a high technologystate-of-the-art wafer package for storing and transportingsemiconductor wafers, disks or substrates which unlocks and opens fromeither side.

Another object of the present invention is horizontally aligned wafersupport articulated cantilevered horizontal arms with centering Vgrooves for flex engagement of wafers, disks or substrates.

A further object of the present invention is to provide articulatedcantilevered horizontal arms with centering V grooves.

BRIEF DESCRIPTION OF THE DRAWINGS

Other objects of the present invention and many of the attendantadvantages of the present invention will be readily appreciated as thesame becomes better understood by reference to the following detaileddescription when considered in connection with the accompanyingdrawings, in which like reference numerals designate like partsthroughout the figures thereof and wherein:

FIG. 1 illustrates a perspective view of a substrate package, thepresent invention;

FIG. 2 illustrates a perspective view of a wafer carrier;

FIG. 3 illustrates a top view of the bottom member;

FIG. 4 illustrates a bottom view of the bottom member;

FIG. 5 illustrates an end view of the bottom member;

FIG. 6 illustrates a bottom view of the top member;

FIG. 7 illustrates a top view of the top member;

FIG. 8 illustrates a cutaway exploded side view in partial cross sectionof the substrate package;

FIG. 9 illustrates an exploded cutaway end view in cross section of thesubstrate package;

FIG. 10 illustrates an end view of the wafer support springs;

FIG. 11 illustrates a side view of the wafer support springs row;

FIG. 12 illustrates a bottom view of the wafer support springs;

FIG. 13 illustrates a top view of a wafer carrier;

FIG. 14 illustrates a sectional profile view of the divider ribs andwafer pockets;

FIG. 15 illustrates a cutaway view of a wafer carrier;

FIG. 16 illustrates a cutaway side view of substrate wafers in thesubstrate package;

FIG. 17 illustrates a cross-sectional view of the assembled substratepackage;

FIG. 18 illustrates a top vieW of a wafer carrier in the bottom member;

FIG. 19 illustrates stacked substrate packages;

FIG. 20 illustrates a perspective view of an alternative embodimentsubstrate package;

FIG. 21 illustrates a perspective view of a wafer carrier;

FIG. 22 illustrates a top view of the bottom member;

FIG. 23 illustrates a bottom view of the bottom member;

FIG. 24 illustrates an end view of the bottom member;

FIG. 25 illustrates a bottom view of the top member;

FIG. 26 illustrates a top view of the top member;

FIG. 27 illustrates a cutaway exploded side view in partial crosssection of the substrate package;

FIG. 28 illustrates an exploded cutaway end view in cross section of thesubstrate package;

FIG. 29 illustrates an end view of the wafer support springs;

FIG. 30 illustrates a side view of the wafer support springs row;

FIG. 31 illustrates a bottom view of the wafer support springs;

FIG. 32 illustrates a top view of a wafer carrier;

FIG. 33 illustrates a sectional profile view of the divider ribs andwafer pockets;

FIG. 34 illustrates a cutaway view of a wafer carrier;

FIG. 35 illustrates a cutaway side view of substrate wafers in thesubstrate package;

FIG. 36 illustrates a cross-sectional end view of the assembledsubstrate package;

FIG. 37 illustrates an isometric view of the articulated cantileveredhorizontal arm with a centering V groove engaging a wafer, disk orsubstrate;

FIG. 38 illustrates a top view of a wafer carrier in the bottom member;and,

FIG. 39 illustrates stacked substrate packages.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

FIG. 1 illustrates a perspective view of a package 10, the presentinvention, for the storage and transportation of substrates or wafers.The package includes a bottom member 12 and a top member 14 engaged toenvironmentally contain and transport or store a wafer carrier 16, whichis illustrated in FIG. 2.

The bottom member 12 includes sides 18, 20, 22 and 24; a continuousvertical member 26 for taping, including planar surfaces 26a, 26b, 26cand 26d with rounded vertical corners therebetween; and a latch recess28 located within the planar surface 26a and a corresponding latchrecess 30 located within planar surface 26c. A handle recess 32 is setback from the side 18, and a like opposing recess 33 is set back fromside 22 as illustrated in FIG. 3. A locating recess index member 34 forindexing a wafer carrier 16 is set back from side 20, and includes wallmembers 20a, 20b, wall member 34a between wall members 20a and 20b and ahorizontal planar member 34b intersecting wall members 20a, 20b and 34a.A continuous lip member 36, as also illustrated in FIG. 3, locates atthe upper portion of the continuous vertical member 26 to mate with acorresponding lip in the top member 14 as later described in detail.Upper planar bottom surfaces 39 and 41, with a cylindrical sectionmember 40 including ends 40a and 40b disposed thereupon and extendingdownwardly from and between the upper planar surfaces 39 and 41, locatesbetween the lower portions of the sides 20 and 24 as illustrated in FIG.3. Channels 42 and 44 locate parallel to sides 18 and 22 along the lowerplanar bottom 38 and the long edges of the cylindrical section member 40for accommodating the wafer carrier 16 as illustrated in FIG. 3.Stacking corner recess members 45a-45d position at the correspondinglower corner portions of the intersections of the sides 18-24 and theplanar bottom 38.

The top member 14 includes sides 46-52; a continuous vertical lip member54 extending downwardly from the sides 46-52 for taping, includingplanar surfaces 54a-54d with rounded vertical corners therebetween;channels 56 and 58 parallel to sides 46 and 50 at the upper portion ofthe sides 46 and 50, respectively, for engagement of the upper regionsof the wafer carrier 16; planar members 53 and 55 adjacent to channels56 and 58 and along the upper portions of the sides 46 and 50; stackingfeet 60a-60d extending from and above the respective intersections ofsides 46-52 and at respective opposing ends of the channels 56 and 58 asillustrated; a planar surface 62 extending between the channels 56 and58 and the upper portions of the sides 48 and 52; and a raisedcylindrical section 64 including ends 64a and 64b extending upwardlyfrom the planar surface 62. Rows of wafer support springs extenddownwardly from the underside of the planar surface to gently securewafer substrates in the wafer carrier 16, as later described in detailin the figures, particularly in FIGS. 10-12. The continuous vertical lipmember 54 fits over the continuous lip member 36 of the bottom member 12to seal the substrate package 10. The top member 14 includes catchmembers 70 and 72 as illustrated in FIGS. 6 and 9, and the bottom member12 includes latch members 74 and 76 each adjacent respectively to thehandle recesses 32 and 33 for secure engagement of the top member 14 tothe bottom member 12 containing the wafer carrier 16.

FIG. 2 illustrates a perspective view of the wafer carrier 16 includingopposing sides 80 and 82; a support bar 84 extending vertically andoutwardly along an end of side 80; a support bar 86 extending verticallyand outwardly along an end of side 82; a configured "H" shaped member 88and segmented rod half 90 between the support bars 84 and 86 and setback from the support bars 84 and 86; a vertically oriented planarmember 92 between the rear portions and flush to the rear portions ofsides 80 and 82; bottom edges 94 and 96 along the bottom portion ofsides 80 and 82, respectively; a planar top edge 98 along the upper edgeof side 80 and between the upper portion support bar 84 and the upperand outer portion of the planar member 92; and a like planar top edge100 extending along the upper edge of side 82 between the upper portionof support bar 86 and the upper and outer portion of the planar member92. Ribs 102a-102n and alternating wafer pockets 104a-104n extendvertically along the distance between the planar top edge 98 and thelower portion of side 80 near which point the ribs 102a-102n and thealternating wafer pockets 104a-104n assume a curved cross section tointersect with the lower portion of side 80. In a similar fashion, ribs106a-106n and alternating wafer pockets 108a-108n extend vertically forthe majority of the distance between the planar top edge 100 and thelower portion of side 82 near which point the ribs 102a-102n and thealternating wafer pockets 104a-104n assume a curved cross section tointersect with the lower portion of side 82. Rounded wafer pocket backs109a-109n and 119a-119n provide for dimensional stability and extendsimilarly to assume a curved cross section to intersect with the lowerportion of side 82, as also illustrated in FIGS. 13 and 14 The planartop edges 98 and 100 include vertically oriented positioning holes andslots 110a-110b and 111a-111b, respectively, near their outerextremities. The wafer carrier 16 also includes robotic handler slots112 and 113 positioned in the support bars 84 and 86, respectively, androbotic handler slots 114 and 116 positioned at the rear of the wafercarrier 16 adjacent to the top edge of the planar member 92 and theupper portions of sides 80 and 82. Robotic tab members 121a and 121bposition on the upper portion of the sides 80 and 82.

FIG. 3 illustrates a top view of the bottom member 12 where all numeralscorrespond to those elements previously described. The latch recess 28includes a latch member 74 with an angulated central support member 120aand angulated support members 120b and 120c extending from themid-portion of the latch member 74 angularly to the lower inner mostarea of the latch recess 28 as also illustrated in FIG. 1. The latchmember 74 is divided into latch surfaces 74a and 74b by the angulatedsupport member 120a. Corresponding angulated latch support members122a-122c extend in a similar fashion from beneath the latch member 76into the latch recess 30 located above the handle recess 33. The latchmember 76 is divided into latch surfaces 76a and 76b by the angulatedsupport member 122a. The handle recess 32 is illustrated includingvertically aligned opposing walls 124 and 126, vertical wall 128 betweenwalls 124 and 126, and an oblique wall 130 slanting toward the center ofthe bottom member 12 and intersecting walls 124-128. Handle recess 33includes similarly oriented and aligned opposing walls 132 and 134, wall136 between walls 132 and 134, and oblique wall 138 interesting walls132-136. Locator ribs 140 and 142 extend respectively between walls 128and 136 and the inner side members of channels 42 and 44 and aid instructural support.

FIG. 4 illustrates a bottom view of the bottom member 12 where allnumerals correspond to those elements previously described.

FIG. 5 illustrates an end view of the bottom member 12 where allnumerals correspond to those elements previously described. Illustratedin particular is the locating recess index member 34 in side 20. Theprofile of the continuous lip member 36 is illustrated as 36a and 36b,where the continuous lip member 36 passes through the areas adjacent tothe latch members 74 and 76, respectively. Lips 36a and 36b seal againstthe horizontal undersides of the continuous planar rim 59 on the packagetop as illustrated in FIG. 17.

FIG. 6 illustrates a bottom view of the top member 14 where all numeralscorrespond to those elements previously described. Rows of flexiblewafer support springs 150 and 152 extend downwardly from the planarsurface 62 to gently secure wafer substrates carries in the wafercarrier 16. The flexible wafer support spring rows 150 and 152 include aplurality of wafer support springs 150a-150n and 152a-152n,respectively. Catch members 70 and 72 position on the planar surfaces54a and 54c, respectively. Catch member 70 includes ramped catches 70aand 70b, and catch member 72 includes ramped catches 72a and 72b. Thecatch members 70 and 72 of the top member 14 engage the latch members 74and 76 of the bottom member 12 as illustrated in FIG. 17.

FIG. 7 illustrates a top view of the top member 14 where all numeralscorrespond to those elements previously described.

FIG. 8 illustrates a cutaway exploded side view in partial cross sectionof the substrate package 10 prior to engagement where all numeralscorrespond to those elements previously described.

FIG. 9 illustrates a cutaway exploded end view in partial cross sectionof the substrate package 10 prior to engagement where all numeralscorrespond to those elements previously described. The bottom member 12is a cross section taken along line 9-9 of FIG. 3.

FIG. 10 illustrates the wafer support springs 152a-152n in the wafersupport spring row 152 where the spring tooth 152a is described indetail. A longitudinal bar member 154 extends horizontally from theplanar surface 62, and a vertically oriented bar member 156 extendsdownwardly from the longitudinal bar member 154. The flexible wafersupport spring 152a extends horizontally from the lower portion of thevertical bar member 156 as illustrated in FIG. 11. The flexible wafersupport spring 152a includes ramped angulated walls 158 and 160 forminga two bar articulated linkage member. A "V" groove 162 extends betweenthe ramped angulated walls 158 and 160 to angled ends 164 and 166 andalong the underside of the flexible spring tooth 152a as alsoillustrated in FIG. 12. The flexible wafer support springs 152a-152n arepliable, and have predetermined flexibility to engage thecircumferential edges of wafer substrates in the "V" groove 162 betweenramped angulated wall members 158 and 160 contained in the substratepackage 10. The wafer support springs make contact with the wafer orsubstrate and flex the wafer support springs.

FIG. 11 illustrates a side view of the wafer support spring row 152 ofFIG. 10 along line 11--11 of FIG. 10 where all numerals correspond tothose elements previously described.

FIG. 12 illustrates a bottom view of the wafer support spring row 152 ofFIG. 11 taken along line 12--12 of FIG. 11.

FIG. 13 illustrates a top view of the wafer carrier 16 where allnumerals correspond to those elements previously described.

FIG. 14 illustrates a sectional view of the divider ribs including tooth106n and wafer slot 108n taken along line 14-14 of FIG. 13. The tip ofthe rib 102n, as well as the wafer slot 108n, is smooth and rounded.

FIG. 15 illustrates a cutaWay side vieW of the wafer carrier 16 whereall numerals correspond to those elements previously described.

MODE OF OPERATION

FIGS. 16 and 17 best illustrate the mode of operation.

FIG. 16 illustrates a cutaway side view of substrates or wafers170a-170n engaged in the package 10 where all numerals correspond tothose elements previously described. The top member 14 and the bottommember 12 are illustrated in full cross section. The wafer carrier 16 iscutaway for view of the latch member 76 above the oblique wall 138. Thelatch recess 30 seals against the continuous vertical lip member 54. Therobotic wafer carrier can be for shipping and storage, and/orprocessing, and can be of a suitable polymer such as polyethylene,Teflon, or other like materials.

FIG. 17 illustrates the cross section of the top and bottom members 14and 12, respectively, engaged with one another over the substrates orwafers 170a-170n in the wafer carrier 16 where all numerals correspondto those elements previously described. The catch members 70 and 72 areillustrated frictionally engaging latch members 74 and 76 wherebycontinuous lip members 36a-36b firmly contact the continuous planar rim59 to seal the top and bottom members 14 and 12 in the area of the catchmembers 70 and 72 and latch members 74 and 76. Particularly illustratedin the drawing is the interlocking and interengaging relationship of thewafer carrier 16 with respect to the top member 14 and the bottom member12 with the substrates or wafers 170a-170n engaged between the wafercarrier 16, the top member 14 and the bottom member 12. The substratesor wafers 170a-170n are engaged between the plurality of teeth 106a-106nand opposing ribs 102a-102n which limits defined movement so that eachsubstrate or wafer is in the center of each pair of divider teethmembers.

The wafer carrier 16, including the substrates or wafers 170a-170n, arefirst placed in the bottom member 12 so that the bottom edges 94 and 96rest in channels 42 and 46 of the bottom member 12. The top member 14 isthen positioned over the carrier containing the substrates or wafers170a-170n. The continuous vertical lip member 54 of the top member 14aligns over the continuous lip member 36 as also illustrated in FIG. 1.Then, the flexible wafer support springs 150a-150n and 152a-152nposition tangentially in flexing engagement against the circumference ofthe substrates or wafers 170a-170n, and the ramped catches 70a-70b and72a-72b partially engage against the latch members 74 and 76. The topmember 14 is positioned incorporating slightly more downward pressureagainst the substrates or wafers 170a-170n by the plurality of wafersupport springs 150a-150n and 152a-152n, which move upwardly asillustrated until the catch surfaces 74a-74b and 76a-76b fully engagethe catches 70 and 72 as the top member 14 centers over the substratesor wafers 170a-170n. The upper portion of the substrates or wafers170a-170n locate in the "V" groove 162 between the ramped angulatedwalls 158 and 160 to assist in uniform lateral spacing of the upperportions of the substrate wafers with respect to each other. The "V"groove 162 between the angled ends 164 and 166 assist in capture of theupper substrate or wafer circumferential surfaces.

The top member 14 engages the wafer carrier 16 when the catch members 70and 72 frictionally engage latch members 74 and 76, holding the wafercarrier 16 securely between the top and bottom members 14 and 12,respectively. More specifically, the planar members 53 and 55 contactand exert uniform downward pressure upon the planar top edges 98 and 100of the wafer carrier 16. This exerted downward pressure is transmittedthrough the structure of the wafer carrier 16 to the wafer carrierbottom edges 94 and 96 which are seated in channels 42 and 44 of thebottom member 12, and is also transmitted to the channels 42 and 44 andthe bottom member 12 in general.

The flexible wafer support springs 150a-150n and 152a-152n gentlycontact the circumference of each of the substrates or wafers 170a-170nrespectively in a tangential fashion to ensure seating of the substratesor wafers 170a-170n within the wafer carrier 16 and within the engagedtop and bottom members 14 and 12 to minimize movement of the substratesor wafers 170a-170n.

Both the wafer carrier 16 and the substrates or wafers 170a-170n areheld in position by the top member 14 and the elements thereof. Thespring action secures the substrates or wafers within the wafer carrier16 and also provides an upward pressure towards the top member 14 withrespect to the bottom member 12 so that when the catches and latches aredisengaged from each other, the top member 14 is sprung upwardly by theaction of the wafer support springs 150a-150n and 152a-152n against thesubstrates or wafers.

FIG. 18 shows that the wafer carrier 16 can be properly oriented andaligned in only one position with respect to the bottom member 12. Thelocating recess index member 34 allows only one proper orientation. The"H" shaped member 88 of the wafer carrier 16 engages over the locatingrecess index member 34. The vertical support bars 84 and 86 positionaround and about the locating recess index member 34. At the same time,planar member 92 of the wafer carrier 16 is closely juxtaposed withrespect to the side 24. If the wafer carrier 16 is rotated 180° ineither direction about its vertical axis, the planar member 92 of thewafer carrier 16 would have to fit in the area occupied by the locatingrecess index member 34 in order for the wafer carrier 16 to fit in thebottom member 12. Of course, the area of the "H" shaped member 88 belowthe segmented rod half 90 and between the vertical support bars 84 and86 is accommodated by the locating recess index member 34.

It is noted that the top member 14 can be placed with either of its endsadjacent to either end of the bottom member 12.

The upper lips engage about the lower lips and the latches with thecatches, and the interengaging relationship between the carrier, thebottom member 12 and the top member 14 about the substrates or wafers170a-170n occurs during engagement. This interengaging relationshipparticularly reflects that the package is a synergistic combinationwhich reduces and eliminates contamination of the wafers, as well asproviding for storage and transportation of the substrates or wafers andproviding a flush perimeter for taping of the top and bottom member 14and 12, respectively, providing for secure shipping and storage. It isnoted that the top member 14 aligns loosely with the bottom member 12before the wafer support springs 150a-150n and 152a-152n align thesubstrates or wafers 170a-170n in the wafer carrier 16 on the centerline of the divider ribs 102a-102n and teeth 106a-106n.

It is also particularly important to note that the latches are flush,providing that the container is suitable not only of being taped, butshrink-wrapped or bagged with some suitable type of polyester,polyethylene or mylar film, further providing a noncontaminate, closedcontainer with structural integrity. This also reduces the cost of thecontainer and maintains structural integrity of the wafers supportedtherein. The wafer carrier with respect to the top member and bottommember engages with the respective components so that the substrates orwafers are in frictional engagement with the entire substrate package.

FIG. 19 illustrates a side view of like substrate packages 10 stackedone upon another where all numerals correspond to those elementspreviously described. Like packages can be stacked by engagement of thestacking corner recess members 45a-45d of the bottom member 12 with thestacking feet 60a-60d of the top member 14 of another upper substratepackage 10.

DESCRIPTION OF THE ALTERNATIVE EMBODIMENT

FIG. 20 illustrates a perspective view of a package 210, the presentinvention, for the storage and transportation of substrates or wafers.The package includes a bottom member 212 and a top member 214 engaged toenvironmentally contain and transport or store a wafer carrier 216,which is illustrated in FIG. 21.

The bottom member 212 includes sides 218, 220, 222 and 224; a continuousvertical member 226 for taping, including planar surfaces 226a, 226b,226c and 226d with rounded vertical corners therebetween; and a latchrecess 228 located within the planar surface 226a and a correspondinglatch recess 230 located within planar surface 226c. A handle recess 232is set back from the side 218, and a like opposing recess 233 is setback from side 222 as illustrated in FIG. 22. A locating recess indexmember 234 for indexing a wafer carrier 216 is set back from side 220,and includes wall members 220a, 220b, wall member 234a between wallmembers 220a and 220b and a horizontal planar member 234b intersectingwall members 220a, 220b and 234a. A continuous lip member 236, as alsoillustrated in FIG. 22, locates at the upper portion of the continuousvertical member 226 to mate with a corresponding lip in the top member214 as later described in detail. Upper planar bottom surfaces 239 and241, with a cylindrical section member 240 including ends 240a and 240bdisposed thereupon and extending downwardly from and between the upperplanar surfaces 239 and 241, locates between the lower portions of thesides 220 and 224 as illustrated in FIG. 22. Channels 242 and 244 locateparallel to sides 218 and 220 along the lower planar bottom 238 and thelong edges of the cylindrical section member 240 for accommodating thewafer carrier 216 as illustrated in FIG. 22. Stacking corner recessmembers 245a-245d position at the corresponding lower corner portions ofthe intersections of the sides 218-224 and the planar bottom 238.

The top member 214 includes sides 246-252; a continuous vertical lipmember 254 extending downwardly from the sides 426-252 for taping,including planar surfaces 254a-254d with rounded vertical cornerstherebetween; channels 256 and 258 parallel to sides 246 and 250 at theupper portion of the sides 246 and 250, respectively, for engagement ofthe upper regions of the wafer carrier 216; planar members 253 and 255adjacent to channels 256 and 258 and along the upper portions of thesides 246 and 250; stacking feet 260a-260d extending from and above therespective intersections of sides 246-252 and at respective opposingends of the channels 256 and 258 as illustrated; an arced cylindricalsection 264 extending between the channels 256 and 258 and the upperportions of the sides 248 and 252; and, cylindrical section ends 264aand 264b extending downwardly from the ends of the arced cylindricalsection 264. Horizontally aligned planar surfaces 262 and 263 extendhorizontally from the upper portions of the sides 248 and 252 andintersect the cylindrical section ends 264a and 264b. Rows ofhorizontally aligned wafer support springs extend downwardly from theunderside of the planar surface to gently secure wafer substrates in thewafer carrier 216, as later described in detail in the figures,particularly in FIGS. 29-31. The continuous vertical lip member 254 fitsover the continuous lip member 236 of the bottom member 212 to seal thesubstrate package 210. The top member 214 includes catch members 270 and272 as illustrated in FIGS. 25 and 28, and the bottom member 212includes latch members 274 and 276 each adjacent respectively to thehandle recesses 232 and 233 for secure engagement of the top member 214to the bottom member 212 containing the wafer carrier 216.

FIG. 21 illustrates a perspective view of the wafer carrier 216including opposing sides 280 and 282; a support bar 284 extendingvertically and outwardly along an end of side 280; a support bar 286extending vertically and outwardly along an end of side 282; aconfigured "H" shaped member 288 and segmented rod half 290 between thesupport bars 284 and 286 and set back from the support bars 284 and 286;a vertically oriented planar member 292 between the rear portions andflush to the rear portions of sides 280 and 282; bottom edges 294 and296 along the bottom portion of sides 280 and 282, respectively; aplanar top edge 298 along the upper edge of side 280 and between theupper portion support bar 284 and the upper and outer portion of theplanar member 292; and a like planar top edge 300 extending along theupper edge of side 282 between the upper portion of support bar 286 andthe upper and outer portion of the planar member 292. Ribs 302a-302n andalternating wafer pockets 304a-304n extend vertically along the distancebetween the planar top edge 298 and the lower portion of side 280 nearwhich point the ribs 302a-302n and the alternating wafer pockets304a-304n assume a curved cross section to intersect with the lowerportion of side 280. In a similar fashion, ribs 306a-306n andalternating wafer pockets 308a-308n extend vertically for the majorityof the distance between the planar top edge 300 and the lower portion ofside 282 near which point the ribs 302a-302n and the alternating waferpockets 304a-304n assume a curved cross section to intersect with thelower portion of side 282. Rounded wafer pocket backs 309a-309n and319a-319r provide for dimensional stability and extend similarly toassume a curved cross section to intersect with the lower portion ofside 282, as also illustrated in FIGS. 32 and 33. The planar top edges298 and 300 include vertically oriented positioning holes and slots310a-310b and 311a-311b, respectively, near their outer extremities. Thewafer carrier 216 also includes robotic handler slots 312 and 314positioned in the support bars 284 and 286, respectively, and robotichandler slots 316 and 318 positioned at the rear of the wafer carrier216 adjacent to the top edge of the planar member 292 and the upperportions of sides 280 and 282. Robotic tab members 321a and 321bposition on the upper portion of the sides 280 and 282.

FIG. 22 illustrates a top view of the bottom member 212 where allnumerals correspond to those elements previously described. The latchrecess 228 includes a latch member 274 with an angulated central supportmember 320a and angulated support members 320b and 320c extending fromthe mid-portion of the latch member 274 angularly to the lower innermost area of the latch recess 228 as also illustrated in FIG. 20. Thelatch member 274 is divided into latch surfaces 274a and 274b by theangulated support member 320a. Corresponding angulated latch supportmembers 322a-322c extend in a similar fashion from beneath the latchmember 276 into the latch recess 230 located above the handle recess233. The latch member 276 is divided into latch surfaces 276a and 276bby the angulated support member 322a. The handle recess 232 isillustrated including vertically aligned opposing walls 324 and 326,vertical wall 328 between walls 324 and 326, and an oblique wall 3? 0slanting toward the center of the bottom member 212 and intersectingwalls 324-328. Handle recess 233 includes similarly oriented and alignedopposing walls 332 and 334, wall 336 between walls 332 and 334, andoblique wall 338 interesting walls 332-336. Locator ribs 340 and 342extend respectively between walls 328 and 336 and the inner side membersof channels 242 and 246 and aid in structural support.

FIG. 23 illustrates a bottom view of the bottom member 212 where allnumerals correspond to those elements previously described.

FIG. 24 illustrates an end view of the bottom member 212 where allnumerals correspond to those elements previously described. Illustratedin particular is the locating recess index member 234 in side 220. Theprofile of the continuous lip member 236 is illustrated as 236a and236b, where the continuous lip member 236 passes through the areasadjacent to the latch members 274 and 276, respectively. Lips 236a and236b seal against the horizontal undersides of the continuous planar rim259 on the package top as illustrated in FIG. 36.

FIG. 25 illustrates a bottom view of the top member 214 where allnumerals correspond to those elements previously described. Rows offlexible wafer support springs 350 and 352, also referred to asarticulated cantilevered horizontal arms, extend horizontally from thesmall radiused surfaces 351 and 353 which are transitions between thearced cylindrical section 264 and the channels 256 and 258, as alsoillustrated in FIG. 28, to gently secure wafer substrates carries in thewafer carrier 216. The flexible wafer support spring rows 350 and 352include a plurality of wafer support spring arms or articulatedcantilevered horizontal arms 350a-350n and 352a-352n, respectively, andare illustrated and described further in FIGS. 29, 30, and 31. Catchmembers 270 and 272 position on the planar surfaces 254a and 254c,respectively. Catch member 270 includes ramped catches 270a and 270b,and catch member 272 includes ramped catches 272a and 272b. The catchmembers 270 and 272 of the top member 214 engage the latch members 274and 276 of the bottom member 212 as illustrated in FIG. 26. Strengthenerstruts 276a-276d are vertically aligned on the inner surface of walls248 and 252.

FIG. 26 illustrates a top view of the top member 214 where all numeralscorrespond to those elements previously described.

FIG. 27 illustrates a cutaway exploded side view in partial crosssection of the substrate package 210 prior to engagement where allnumerals correspond to those elements previously described.

FIG. 28 illustrates a cutaway exploded end view in partial cross sectionof the substrate package 210 prior to engagement where all numeralscorrespond to those elements previously described. The bottom member 212is a cross section taken along line 28--28 of FIG. 22.

FIG. 29 illustrates an end view along line 29--29 of FIG. 28 of thewafer support springs 352a-352n in the wafer support spring row 352where the spring tooth 352a is described in detail. The flexible wafersupport spring 352a extends horizontally from the small radius surface356 as illustrated in FIG. 31. The flexible wafer support spring 352aincludes ramped angulated walls 358 and 360. A "V" groove 362 extendsbetween the ramped angulated walls 358 and 360 along the underside ofthe flexible spring tooth 352a as also illustrated in FIG. 30. Theflexible wafer support springs 352a-352n are pliable, and havepredetermined flexibility to engage the circumferential edges of wafersubstrates in the "V" groove 362 between ramped angulated wall members358 and 360 contained in the substrate package 210. The wafer supportsprings make contact with the wafer or substrate and flex the wafersupport springs.

FIG. 30 illustrates a side view of the wafer support spring row 352 ofFIG. 29 along line 30--30 of FIG. 29 where all numerals correspond tothose elements previously described.

FIG. 31 illustrates a bottom view of the wafer support spring row 352 ofFIG. 30 taken along line 31--31 of FIG. 29.

FIG. 32 illustrates a top view of the wafer carrier 216 where allnumerals correspond to those elements previously described.

FIG. 33 illustrates a sectional view of the divider ribs including tooth306n and wafer slot 308n taken along line 33--33 of FIG. 32. The tip ofthe rib 302n, as well as the wafer slot 308n, is smooth and rounded.

FIG. 34 illustrates a cutaway side view of the wafer carrier 216 whereall numerals correspond to those elements previously described.

MODE OF OPERATION OF THE ALTERNATIVE EMBODIMENT

FIGS. 35 and 36 best illustrate the mode of operation.

FIG. 35 illustrates a cutaway side view of substrates or wafers370a-370n engaged in the package 210 where all numerals correspond tothose elements previously described. The top member 214 and the bottommember 212 are illustrated in full cross section. The wafer carrier 216is cutaway for view of the latch member 276 above the oblique wall 338.The latch recess 230 seals against the continuous vertical lip member254. The robotic wafer carrier can be for shipping and storage, and/orprocessing, and can be of a suitable polymer such as polyethylene,Teflon, or other like materials.

FIG. 36 illustrates the cross section of the top and bottom members 214and 212, respectively, engaged with one another over the substrates orwafers 370a-370n in the wafer carrier 216 where all numerals correspondto those elements previously described. The catch members 270 and 272are illustrated frictionally engaging latch members 274 and 276 wherebycontinuous lip members 236a-236b firmly contact the continuous planarrim 259 to seal the top and bottom members 214 and 212 in the area ofthe catch members 270 and 272 and latch members 274 and 276.Particularly illustrated in the drawing is the interlocking andinterengaging relationship of the wafer carrier 216 with respect to thetop member 214 and the bottom member 212 with the substrates or wafers370a-370n engaged between the wafer carrier 216, the top member 214 andthe bottom member 212. The substrates or wafers 370a-370n are engagedbetween the plurality of teeth 306a-306n and opposing ribs 302a-302nwhich limits defined movement so that each substrate or wafer is in thecenter of each pair of divider teeth members.

The wafer carrier 216, including the substrates or wafers 370a-370n, arefirst placed in the bottom member 212 so that the bottom edges 294 and296 rest in channels 242 and 246 of the bottom member 212. The topmember 214 is then positioned over the carrier containing the substratesor wafers 370a-370n. The continuous vertical lip member 254 of the topmember 214 aligns over the continuous lip member 236 as also illustratedin FIG. 20. Then, the flexible wafer support springs 350a-350n and352a-352n position tangentially in flexing engagement against thecircumference of the substrates or wafers 370a-370n, and the rampedcatches 270a-270b and 272a-272b partially engage against the latchmembers 274 and 276. The top member 214 is positioned incorporatingslightly more downward pressure against the substrates or wafers370a-370n by the plurality of wafer support springs 350a-350n and352a-352n, which move upwardly as illustrated until the catch surfaces274a-274b and 276a-276b fully engage the catches 270 and 272 as the topmember 214 centers over the substrates or wafers 370a-370n. The upperportion of the substrates or wafers 370a-370n locate in the "V" groove362 between the ramped angulated walls 358 and 360 to assist in uniformlateral spacing of the upper portions of the substrate wafers withrespect to each other. The "V" groove 362 between the angled ends 364and 366 assist in capture of the upper substrate or wafercircumferential surfaces.

The top member 214 engages the wafer carrier 216 when the catch members270 and 272 frictionally engage latch members 274 and 276, holding thewafer carrier 216 securely between the top and bottom members 214 and212, respectively. More specifically, the planar members 253 and 255contact and exert uniform downward pressure upon the planar top edges298 and 300 of the wafer carrier 216. This exerted downward pressure istransmitted through the structure of the wafer carrier 216 to the wafercarrier bottom edges 294 and 296 which are seated in channels 242 and244 of the bottom member 212, and is also transmitted to the channels242 and 244 and the bottom member 212 in general.

The flexible wafer support springs 350a-350n and 352a-352n gentlycontact the circumference of each of the substrates or wafers 370a-370nrespectively in a tangential fashion to ensure seating of the substratesor wafers 370a-370n within the wafer carrier 216 and within the engagedtop and bottom members 214 and 212 to minimize movement of thesubstrates or wafers 370a-370n.

Both the wafer carrier 216 and the substrates or wafers 370a-370n areheld in position by the top member 214 and the elements thereof. Thespring action secures the substrates or wafers within the wafer carrier216 and also provides an upward pressure towards the top member 214 withrespect to the bottom member 212 so that when the catches and latchesare disengaged from each other, the top member 214 is sprung upwardly bythe action of the wafer support springs 350a-350n and 352a-352n againstthe substrates or wafers.

FIG. 37 illustrates an isometric view of a articulated cantileveredhorizontal arm 352a, also referred to as a like flexible wafer supportspring arms 350a-350n and 352a-352n in spring support arm rows 350 and352. with a centering V groove 362 engaging a wafer, disk or substrate370a at two contact points 364 and 366. The wafer, disk or substrate370a is supported in the V groove 362 at each side of the V groove andis centered by the action of the V groove 362 against the edges of thewafer, disk or substrate 370a.

FIG. 38 shows that the wafer carrier 216 can be properly oriented andaligned in only one position with respect to the bottom member 212. Thelocating recess index member 234 allows only one proper orientation. The"H" shaped member 288 of the wafer carrier 216 engages over the locatingrecess index member 234. The vertical support bars 284 and 286 positionaround and about the locating recess index member 234. At the same time,planar member 292 of the wafer carrier 216 is closely juxtaposed withrespect to the side 224. If the wafer carrier 216 is rotated 180° ineither direction about its vertical axis, the planar member 292 of thewafer carrier 216 would have to fit in the area occupied by the locatingrecess index member 234 in order for the wafer carrier 216 to fit in thebottom member 212. Of course, the area of the "H" shaped member 288below the segmented rod half 290 and between the vertical support bars284 and 286 is accommodated by the locating recess index member 234.

It is noted that the top member 214 can be placed with either of itsends adjacent to either end of the bottom member 212.

The upper lips engage about the lower lips and the latches with thecatches, and the interengaging relationship between the carrier, thebottom member 212 and the top member 214 about the substrates or wafers370a-370n occurs during engagement. This interengaging relationshipparticularly reflects that the package is a synergistic combinationwhich reduces and eliminates contamination of the wafers, as well asproviding for storage and transportation of the substrates or wafers andproviding a flush perimeter for taping of the top and bottom member 214and 212, respectively, providing for secure shipping and storage. It isnoted that the top member 214 aligns loosely with the bottom member 212before the wafer support springs 350a-350n and 352a-352n align thesubstrates or wafers 370a-370n in the wafer carrier 216 on the centerline of the divider ribs 302a-302n and teeth 306a-306n.

It is also particularly important to note that the latches are flush,providing that the container is suitable not only of being taped, butshrink-wrapped or bagged with some suitable type of polyester,polyethylene or mylar film, further providing a noncontaminate, closedcontainer with structural integrity. This also reduces the cost of thecontainer and maintains structural integrity of the wafers supportedtherein. The wafer carrier with respect to the top member and bottommember engages with the respective components so that the substrates orwafers are in frictional engagement with the entire substrate package.

FIG. 39 illustrates a side view of like substrate packages 210 stackedone upon another where all numerals correspond to those elementspreviously described. Like packages can be stacked by engagement of thestacking corner recess members 245a-245d of the bottom member 212 withthe stacking feet 260a-260d of the top member 214 of another uppersubstrate package 210.

Various modifications can be made to the present invention withoutdeparting from the apparent scope hereof.

We claim:
 1. A sealable contamination proof container package bottom andtop for storing and transporting a plurality of wafers, disks orsubstrates in a wafer carrier comprising:a. a package bottom includingfour sides, a continuous vertical surface for tape sealing surroundingthe four sides, a lip positional on said vertical surface, opposing hooklatches on opposing sides, opposing hand grip recesses on the opposingsides and a raised bottom surface for package stacking; and, b. apackage top including four sides, a continuous vertical surface for tapesealing, and surrounding the four sides, a lip positioned on saidvertical surface, opposing hook catches on the opposing side, a topsurface including raised stacking surfaces, and two rows of opposingarticulated cantilevered horizontal arms with centering V grooves forengaging the wafer and projecting substantially horizontally directlyinwardly from said top surface of said package top, disk or substratepositioned on the underside of the top surface at each side of said topsurface whereby the package top and bottom halves provide that the wafercarrier mates between the package top and the package bottom with thewafers, disks or substrates in the carrier.
 2. Package of claim 1wherein said package top and bottom mate with said upper lip engagedagainst said lower lip, and said catch of said top engages with saidlatch of said bottom.
 3. Package of claim 1 wherein the package halvesmove in a direction coinciding to the plane of the wafers with respectto positioning of said catches and latches on said package side. 4.Package of claim 1 wherein said sides of said package top and bottom areplumb with each other providing for a flush perimeter for ease oftaping.
 5. Package of claim 1 wherein said package top and said packagebottom are of a polypropylene material or similar material.
 6. Packageof claim 1 including means for locating the wafer carrier.
 7. A sealablecontamination proof container package bottom and top for storing andtransporting a plurality of wafers, disks or substrates in a wafercarrier comprising:a. a package bottom including four sides, acontinuous vertical surface for tape sealing surrounding the four sides,a lip positional on said vertical surface, opposing hook latches onopposing sides, opposing hand grip recesses on the opposing sides and araised bottom surface for package stacking; b. a package top includingfour sides, a continuous vertical surface for tape sealing, andsurrounding the four sides, a lip positioned on said vertical surface,opposing hook catches on the opposing side, an arced top surface with araised stacking surface, and two rows of opposing articulatedcantilevered horizontal arms with centering V grooves for engaging thewafer projecting substantially horizontally directly inwardly from saidarced top surface of said package top whereby the package top and bottomhalves provide that the wafer carrier mates between the package top andthe package bottom with the wafers or substrates in the carrier; and,wafer carrier including opposing closed side walls, a rear wall and acrossbar connecting the sidewalls and means on said carrier for robotichandling.
 8. A device for containing a plurality of wafers, disks orsubstrates comprising:a. a rectangular package bottom having hand gripindentations; b. a removable wafer carrier having a plurality of spacedvertical channels for frictionally engaging said plurality of waferswherein said removable wafer carrier mounts engagingly with saidrectangular package bottom; and, c. a rectangular package top whichmounts sealingly on said rectangular package bottom having a pluralityof opposing articulated cantilevered horizontal arms with centering Vgrooves for engaging the wafer and projecting substantially horizontallydirectly inwardly from said arced top surface of said package top forengagingly holding said plurality of wafers when said plurality ofwafers are frictionally engaged within said removable wafer carrier andsaid removable wafer carrier is engagingly mounted within saidrectangular package bottom and said rectangular package top is sealinglymounted on said rectangular package bottom.
 9. A device for containing aplurality of wafers, disks or substrates according to claim 8 whereinsaid plurality of opposing articulated cantilevered horizontal arms ofsaid rectangular package top are arranged as a plurality of splinedopposing articulated cantilevered horizontal arm pairs wherein each ofsaid plurality of splined pairs engagingly holds a different on of saidplurality of wafers, disks or substrates.
 10. A device according toclaim 9 wherein each of said plurality of splined opposing articulatedcantilevered horizontal arm pairs are two opposed splined articulatedcantilevered horizontal arms wherein each of said two opposed splinedarticulated cantilevered horizontal arms is individually attached tosaid rectangular package top.